This study examines different types of heat sinks and their structures and how rectifier diode resistance affects heat production, as shown by transient and stability analyses. Overheating of electronic components, particularly switching devices and the inability of heat sinks to effectively manage thermal effects are common issues in electrical design. Properly designing heat sink environments can improve the overall design of electrical components. The transient and stability analyses show that surface temperature fluctuates, causing inconsistent heat dissipation, particularly on the plate and rib surfaces. Long radiators, in particular, exhibit significant temperature variations, with their upper sections cooling less effectively and absorbing less heat. To address these issues, a range of heat sink types were designed and analyzed using Matlab/Simulink, focusing on composition, shape, and structure. The study modeled steady-state and transient behavior, and the findings demonstrate that optimizing heat sink design and material selection can significantly improve heat dissipation, enhancing the reliability and longevity of switching devices in high-power applications.
